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High-Purity White D50 Spherical Alumina Powder with 3.60 g/cm³ Specific Gravity for Thermal Interface Materials

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High-Purity White D50 Spherical Alumina Powder with 3.60 g/cm³ Specific Gravity for Thermal Interface Materials

Brand Name : KEGU

Place of Origin : China

Price : 200-500 yuan/kg

Payment Terms : L/C,D/A,D/P,T/T,Western Union,MoneyGram

Supply Ability : 2,000 pcs/month

Packaging Details : Strong wooden box for Global shipping

Model Number : Customizable

Material : SiC

Composition:SiC : ＞85%

Color : Black

Density : ≥3.65g/cm3

Max. Service Temp : 1380℃

Flexural Strength : 250MPa

Hardness : ≥84HRA

Water Absorption : ≤0.2%

Abrasion : < 0.02%

Bending strength : ≥290MPa

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High-Purity Spherical Alumina Powder - White D50 Powder with 3.60 g/cm³ Specific Gravity for Thermal Interface Materials
This premium spherical alumina powder features exceptional globularity and high thermal conductivity, manufactured through advanced high-temperature melting technology. With its unique spherical morphology and high α-Al₂O₃ content, it delivers superior performance as a functional filler in thermal interface materials, ceramic composites, and electronic packaging applications.
High-Purity White D50 Spherical Alumina Powder with 3.60 g/cm³ Specific Gravity for Thermal Interface Materials
Technical Specifications
Available Particle Size Distributions
Type D50 (μm) Specific Surface Area (m²/g)
SA-05 5 ± 1 0.60
SA-10 10 ± 2 0.50
SA-20 20 ± 3 0.40
SA-30 30 ± 3 0.30
SA-40 40 ± 5 0.20
SA-70 70 ± 6 0.12
Physical Properties
  • Appearance: White free-flowing powder
  • Specific Gravity: 3.60 g/cm³
  • Melting Point: 2050°C
  • Moisture Content: ≤ 0.05%
  • Electrical Conductivity: ≤ 10 μS/cm
  • pH Value: 7.0 ± 0.5
  • α-Al₂O₃ Content: ≥ 90%
  • Sphericity Ratio: ≥ 95%
Chemical Composition (All Types)
  • Al₂O₃: ≥ 99.0%
  • SiO₂: ≤ 0.05%
  • Fe₂O₃: ≤ 0.05%
  • Na₂O: ≤ 0.02-0.03%
  • Other Oxides (K₂O, MgO, CaO): ≤ 0.01-0.02%
Key Performance Characteristics
  • High Packing Density: Optimized particle size distribution enables dense packing in polymers and ceramics, resulting in compounds with lower viscosity and improved flow characteristics
  • Enhanced Thermal Conductivity: Superior packing efficiency creates effective heat transfer pathways, enabling formulation of high thermal conductivity composites (2-10 W/m*K) that outperform conventional crystalline silica fillers
  • Reduced Equipment Wear: Perfect spherical morphology minimizes abrasion to processing equipment, extending service life of mixing, molding, and extrusion machinery
  • Excellent Electrical Properties: Low moisture content and electrical conductivity make it suitable for demanding electronic applications
Primary Applications
  • Thermal Management Materials: Fillers for thermal grease, phase change materials, thermal pads, heat sink composites, and MC (Metal Core) PCB thermal filling compounds
  • Electronic Packaging: Semiconductor encapsulation resins, silicone-based thermal adhesives, and potting compounds for electronic components
  • Advanced Ceramics & Composites: Ceramic molding compounds, high-performance refractory materials, and technical ceramic formulations
Competitive Advantages
  • Superior Sphericity (>95%) for optimal flow and packing
  • High Purity (99% Al₂O₃) for demanding applications
  • Controlled Particle Size distributions for specific formulation needs
  • Proven Performance in thermal interface materials and electronic composites
Looking to enhance your material's thermal performance? Contact our technical team for product samples and application guidance tailored to your specific requirements.

Product Tags:

Sphercial Alumina Powder

      

D50 Alumina Powder

      

Alumina Powder 3.60g/Cm3

      
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