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Shaanxi KeGu New Material Technology Co., Ltd
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High-Performance Aluminum Nitride Ceramic Parts with Exceptional Thermal Conductivity and Superior Electrical Insulation for Controlled Thermal

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High-Performance Aluminum Nitride Ceramic Parts with Exceptional Thermal Conductivity and Superior Electrical Insulation for Controlled Thermal

Material : SiC

Composition:SiC : ＞85%

Color : Black

Density : ≥3.65g/cm3

Max. Service Temp : 1380℃

Flexural Strength : 250MPa

Hardness : ≥84HRA

Water Absorption : ≤0.2%

Abrasion : < 0.02%

Bending strength : ≥290MPa

Model Number : Customizable

Brand Name : KEGU

Place of Origin : China

Price : 200-500 yuan/kg

Payment Terms : L/C,D/A,D/P,T/T,Western Union,MoneyGram

Supply Ability : 2,000 pcs/month

Packaging Details : Strong wooden box for Global shipping

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High-Performance Aluminum Nitride (AlN) Ceramic Parts for Thermal Management & Electronics
Aluminum Nitride (AlN) stands alone as the premier technical ceramic material, uniquely combining exceptional thermal conductivity with superior electrical insulation properties. This rare combination makes it the ideal material solution for high-power electronics, advanced semiconductor processing, and demanding thermal management applications.
High-Performance Aluminum Nitride Ceramic Parts with Exceptional Thermal Conductivity and Superior Electrical Insulation for Controlled Thermal
Key Material Properties & Advantages
  • Exceptional Thermal Conductivity (180-220 W/m*K)
    • Rapidly dissipates heat from critical components
    • Enables higher power densities and improved device reliability
  • Excellent Electrical Insulation
    • High dielectric strength and volume resistivity
    • Prevents current leakage in high-voltage applications
  • Controlled Thermal Expansion
    • CTE closely matches silicon (4.7-5.6 * 10⁻⁶/K)
    • Reduces thermal stress in semiconductor packages
  • Superior Metallization Capability
    • Compatible with thick-film and thin-film processes
    • Enables robust brazing and bonding solutions
Advanced Manufacturing Processes
We employ multiple forming technologies to produce precision AlN components:
  • Dry Pressing: Cost-effective for high-volume, simple geometries
  • Cold Isostatic Pressing (CIP): Superior density for complex shapes
  • Tape Casting: Ideal for thin substrates and multilayer structures
  • Extrusion: Suitable for long, continuous profiles
Applications Across Industries
Semiconductor Manufacturing
  • Etch chamber components
  • Plasma shower heads
  • Wafer processing fixtures
Power Electronics & LED
  • High-power ceramic substrates
  • LED heat sinks and packages
  • IGBT modules and power devices
Thermal Management Systems
  • Heat spreaders and dissipators
  • Thermal interface materials
  • Cooling system components
Electrical Insulation
  • High-voltage insulators
  • RF microwave packages
  • Electrical bushings and spacers
Why Choose Our Aluminum Nitride Components?
  • Material Expertise: Deep understanding of AlN properties and processing
  • Precision Manufacturing: Tight tolerances and superior surface finishes
  • Custom Solutions: Tailored components for specific application requirements
  • Quality Assurance: Rigorous testing and quality control procedures
Need AlN components for your thermal management challenge? Contact our engineering team to discuss how our Aluminum Nitride solutions can enhance your product performance and reliability.

Product Tags:

AlN Aluminum Nitride Parts

      

Semiconductor Equipment Aluminum Nitride Parts

      

AlN Semiconductor Equipment Parts

      
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