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High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction

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High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction

Model Number : Customizable

Brand Name : KEGU

Place of Origin : China

Price : 200-500 yuan/kg

Payment Terms : L/C,D/A,D/P,T/T,Western Union,MoneyGram

Supply Ability : 2,000 pcs/month

Packaging Details : Strong wooden box for Global shipping

Material : SiC

Composition:SiC : ＞85%

Color : Black

Density : ≥3.65g/cm3

Max. Service Temp : 1380℃

Flexural Strength : 250MPa

Hardness : ≥84HRA

Water Absorption : ≤0.2%

Abrasion : < 0.02%

Bending strength : ≥290MPa

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Approximate Spherical Alpha Alumina Powder | High-Purity Thermal Conduction Filler
Enhance Thermal Management with Precision-Engineered Alumina Fillers

Our high-purity approximate spherical alpha alumina powder is specifically formulated to maximize thermal conductivity in polymer composites and thermal interface materials. With controlled particle size distribution and exceptional purity, this advanced ceramic filler enables superior heat dissipation in demanding electronic applications.

Technical Specifications
Parameter Unit SW-2 SW-5 SW-8 SW-15 SW-20
Al₂O₃ Content % ≥99.5 ≥99.5 ≥99.5 ≥99.5 ≥99.5
SiO₂ % ≤0.10 ≤0.08 ≤0.08 ≤0.08 ≤0.08
Fe₂O₃ % ≤0.03 ≤0.03 ≤0.03 ≤0.03 ≤0.03
Na₂O % ≤0.10 ≤0.10 ≤0.10 ≤0.10 ≤0.10
LOI % ≤0.10 ≤0.10 ≤0.10 ≤0.10 ≤0.10
H₂O % ≤0.10 ≤0.10 ≤0.10 ≤0.10 ≤0.10
D50 μm 3.0±0.5 6.5±0.5 9.0±2.0 13.0±2.0 20.0±2.0
Density g/cm³ 0.6±0.2 0.9±0.2 1.0±0.2 1.0±0.2 1.2±0.2
Oil Absorption % ≤45 ≤40 ≤35 ≤30 ≤30
Key Features & Benefits
  • High Purity Composition: ≥99.5% Al₂O₃ content ensures optimal thermal performance and electrical insulation
  • Optimized Particle Morphology: Approximately spherical shape enables higher packing density and improved flow characteristics
  • Controlled Particle Size Distribution: Multiple D50 grades from 3μm to 20μm allow for precise formulation optimization
  • Reduced Oil Absorption: Lower resin demand enables higher filler loading and enhanced thermal conductivity
  • Excellent Filling Performance: Designed to maximize particle concentration in composite materials
Primary Applications
  • Thermal Interface Materials: High-performance thermal greases, gap fillers, and thermally conductive gels
  • Thermal Management Systems: Thermally conductive gaskets, pads, and phase change materials
  • Electronic Packaging: Epoxy molding compounds, underfill materials, and encapsulants
  • Polymer Composites: Thermally conductive plastics, adhesives, and potting compounds
Why Choose Our Alpha Alumina?
  • Enhanced Thermal Conductivity: High purity and optimized morphology directly improve heat transfer efficiency
  • Process Compatibility: Excellent dispersion characteristics simplify manufacturing processes
  • Formulation Flexibility: Multiple size options enable bimodal or multimodal distribution designs
  • Reliable Performance: Consistent batch-to-batch quality ensures predictable composite properties
High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction

Product Tags:

Spherical Alpha Alumina Powder

      

Alpha Alumina Powder D50

      

Alpha Alumina Powder 20um

      
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